2.0D, 2.2D, 2.1D, 2.3D Integrated Substrate Provider
No through vias(TSVs, TLVs..) required.
No solders required between interposer / substrate / PCB.
One Integrated Substrate can replace the combination of silicon interposer and substrate.
Meet functional requirements and simplifies the manufacturing logistic.
Quick product prototyping.
SiPlus is developing system integration technologies and products that meet functional requirement with less impact to the environment.