TECHNOLOGY

2.0D, 2.2D, 2.1D, 2.3D Integrated Substrate Provider


No through vias(TSVs, TLVs..) required.

No solders required between interposer / substrate / PCB.

One Integrated Substrate can replace the combination of silicon interposer and substrate.

Meet functional requirements and simplifies the manufacturing logistic.

Quick product prototyping.

ABOUT US

SiPlus is developing system integration technologies and products that meet functional requirement with less impact to the environment.

WORK WITH SiPlus

2022-03-23

2022 CSR paper

2021-12-16

2021 IMPACT Conference: Invited Talk

Dr. DC Hu, IMPACT’s invited talk on “Integrated Substrate Solutions for Heterogeneous Integration” in Nangang Exhibition Hall Taipei, Taiwan on Dec. 23, 2021.

2021-07-20

Work with SiPlus

  • No. 101, Sec. 2, Kung Fu Rd., Hsinchu City 30013, Taiwan Room 720, Innovation and Incubation Hall, National Tsing Hua University
  • TEL: 0916767301
  • EMAIL: eh.chen@si2plus.com