TECHNOLOGY

2.0D, 2.2D, 2.1D, 2.3D Integrated Substrate Provider


No through vias(TSVs, TLVs..) required.

No solders required between interposer / substrate / PCB.

One Integrated Substrate can replace the combination of silicon interposer and substrate.

Meet functional requirements and simplifies the manufacturing logistic.

Quick product prototyping.

ABOUT US

SiPlus is developing system integration technologies and products that meet functional requirement with less impact to the environment.

WORK WITH SiPlus

2023-01-11

ECTC 2022 Conference

2023-01-11

WLPS 2023 Conference

2023-01-11

ICEP 2023 Conference

2023-01-09

IMAPS 2020 Conference Paper on 2.0D

2023-01-09

ECTC 2021 conference paper on 2.2D

2022-03-23

Chip Scale Review, 2022 March Issue

2021-07-20

Work with SiPlus

  • No. 101, Sec. 2, Kung Fu Rd., Hsinchu City 30013, Taiwan Room 720, Innovation and Incubation Hall, National Tsing Hua University
  • TEL: 0916767301
  • EMAIL: eh.chen@si2plus.com