3. WLPS 2023 Conference

Wafer level package symposium (WLPS) will be held in Feb. 14-16 in Fremount CA. Dr. Hu will present a paper titled “Method of doubling the wafer level RDL layers in 2.2D and RDL Substrate”. Furthermore, a booth will be setup by SiPlus and his RDL partner Rayteksemi. Welcome business discussions.

  • No. 101, Sec. 2, Kung Fu Rd., Hsinchu City 30013, Taiwan Room 720, Innovation and Incubation Hall, National Tsing Hua University
  • TEL: 0916767301
  • EMAIL: